Samsung HBM4 chips exceed expectations
Jun Young-hyun, co-CEO of Samsung Electronics, pointed to positive customer feedback on the company’s HBM4 chips. Customers have expressed their satisfaction with the chip’s competitive edge and remarked that “Samsung is back” in the high-bandwidth memory market. Jun acknowledged this progress, but also stressed that efforts must continue to further enhance the chip’s competitiveness.
Semiconductor manufacturer SK Hynix’ CEO Kwak Noh-Jung acknowledged the favourable market conditions for artificial intelligence chips, where demand is outpacing expectations. He also pointed to increasing competition and a shift in perspective, with AI demand now being seen more as a given than as a windfall.
Looking ahead, Kwak underlined the importance of decisive investments and sustained efforts to be prepared for future challenges, predicting a more demanding business climate in 2026 compared to the previous year.
Jun Young-hyun also expressed optimism about Samsung’s foundry operations, citing recent supply agreements with major global customers as a catalyst for significant growth. In July, Samsung signed a substantial $16.5 billion deal with Tesla.
Co-CEO TM Roh, who oversees Samsung Electronics’ Device Experience division, acknowledged the possibility of greater uncertainty and risks in 2026. He cited rising component prices and global tariff barriers as key concerns. To stay ahead of the competition, Roh emphasised the company’s commitment to proactively diversifying its supply chain and optimising global operations to address the challenges related to sourcing components, pricing, and global tariff risks.
Business AM
Subscribers 0
Fans 0
Followers 0
Followers