IBM researchers, in collaboration with the Fraunhofer Institute in Berlin, have demonstrated a cooling system prototype that works by piping water directly between each layer in a stack of micro-chips.
These so-called 3-D chip stacks – which take chips and memory devices that traditionally sit side-by-side on a silicon wafer and stacks them together on top of one another – presents one of the most promising approaches to enhancing chip performance beyond its predicted limits.
This follows IBM’s leadership in advancing chip-stacking technology in a manufacturing environment
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